Chemical vapor deposition
Chemical vapor deposition (CVD) is a chemical process used to produce high quality, high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Microfabrication processes widely use CVD to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon ( SiO, germanium, carbide, nitride, oxynitride), carbon ( fiber, nanofibers, nanotubes, diamond and graphene), fluorocarbons, filaments, tungsten, titanium nitride and various high-k dielectrics.
Chemical Vapor Deposition (journal)
Chemical Vapor Deposition is a monthly peer-reviewed scientific journal covering materials science. It publishes Reviews, Short Communications, and Full Papers on all aspects of chemical vapor deposition and related technologies, along with other articles presenting opinion, news, conference information, and book reviews. Frequent topics covered by the journal also include inorganic chemistry, materials chemistry, organometallics, applied physics and semiconductor technology, thin films, and ceramic processing.
Usage examples of "chemical vapor deposition".
The toaster was the key to a process called gaseous carbonyl extraction, which allowed the extraction of ultra-pure metals -- and, as a bonus, the direct fabrication of ultra-pure iron and nickel products in high-precision molds via chemical vapor deposition.
The toaster was the key to a process called gaseous carbonyl extraction, which allowed the extraction of ultra-pure metals-and, as a bonus, the direct fabrication of ultra-pure iron and nickel products in high-precision molds via chemical vapor deposition.